Micron, SK Commit Billions to RAM Capacity, but Almost Nothing Lands Before 2028
Micron backs US wafer supply with $500M while SK hynix preps Indiana HBM packaging and commits $38B to two new Korean fabs.
Summary
Micron is investing $500 million to support US wafer supply, while SK hynix is planning a significant $38 billion expansion for new fabs in Korea and preparing HBM packaging in Indiana. Despite these commitments, substantial increases in RAM capacity won’t materialize until 2028.
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